Under the initiative of HE Kittisetha Bandit, Senior Minister, Minister of Industry, Science, Technology and Innovation
Cooperation to expedite the issuance of patents in Cambodia has been made continuously with many countries, including: Singapore, Japan, China, South Korea and the European Union. In order to expedite the registration and protection of patent patent validation in Cambodia as soon as possible and more.
In fact, on the night of October 21, 2020, at the Ministry’s office, a new Memorandum of Understanding (MoU) was signed on cooperation to expedite the issuance of logical patents. In Cambodia between the Ministry of Industry, Science, Technology and Innovation (MISTI) and the United States Patent and Trademark Office (USPTO).
The signing ceremony of this ceremony, which was done online, was between HE Kittisetha Dr. Cham Prasidh, Senior Minister, Minister of Industry, Science, Technology and Innovation, and HE Andrei lancu, Director of the Post Office. United States Trademarks and Trademarks (USPTO) from Washington, USA. His Excellency Patrick Murphy, US Ambassador to Cambodia, was present at the signing ceremony at the Ministry of Industry, Science, Technology and Innovation.
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